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WSDA-157GN
802.11n SDIO Module, Qualcomm Atheros AR6003, 1T1R, U.FL or Printed Antenna

‧ Standard: 802.11b/g/n
‧ Interface: SDIO 2.0 (pin header, wafer connector, or half hole/ castellation on the edge)
‧ Chipset: Qualcomm Atheros AR6003
‧ Antenna: 1 x U.FL connector or 1 x printed antenna, 1T1R
‧ Data rate up to 150Mbps
‧ Enhanced wireless security: WEP, WPA, WPA2
‧ Support Linux, Android

*Not recommended for new design

Specification Hardward Layout Download Certification

Small-Sized and Power-Efficient

SparkLAN WSDA-157GN is a small-sized SDIO module based on Qualcomm Atheros AR6003 chipset. It uses advanced 802.11b/g/n technology, which delivers up to 15dBm output. With Atheros EPA (Efficient Power Amplifier) technology, WSDA-157GN reduces power consumption to achieve the latest trend of Green technology.


Various I/O Interface & Antenna for Design Flexibility
WSDA-157GN SDIO module has various I/O interfaces, such as pin header, wafer, and castellation edge, which allows manufactures to easily add Wi-Fi function to their devices. Customers can also choose between printed or U.FL antenna based on their requirement. SparkLAN is the first in industry to provide small-sized highly customized SDIO module to satisfy differentiated needs of customers.  

 

Coexistence with Bluetooth Co-located Devices
The AR6003 chipset features Atheros Universal Wireless Cooperation technology, which is a suite of WiFi coexistence techniques to enhance simultaneous operation of WLAN and Bluetooth on the same device.  

 

*If you are not sure what you want, please speak to our sales at sales@sparklan.com

 
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